Jetson Orin Nano Module Alignment Issues with SODIMM Connector

Issue Overview

Users working with the Jetson Orin Nano 8GB module have reported difficulties in achieving precise alignment with a specific SODIMM connector (TE Connectivity part number 2309407-1). The main symptoms include:

• Inability to determine the center position of the Jetson Orin Nano module in relation to the SODIMM connector, which is crucial for accurate footprint creation.
• Challenges in establishing the optimal distances between the module and the SODIMM connector, hindering integration efforts.
• Users have attempted to locate relevant documentation but have not found specific guidelines or drawings that detail these measurements.

The issue appears during the design and integration phase of projects involving these components. Users have expressed frustration due to a lack of clear specifications, which impacts their ability to create functional prototypes. The problem has been consistent among various users, suggesting a broader need for detailed alignment information.

Possible Causes

Several potential causes could explain the difficulties users are experiencing:

• Documentation Gaps: Existing documentation may lack detailed measurements or specifications regarding the alignment of the Jetson Orin Nano module and SODIMM connector.

• Misinterpretation of CAD Models: Users may struggle to accurately interpret 3D CAD STEP models, leading to misalignment in their designs.

• Inadequate Design Tools: Some users might not have access to advanced design tools that can accurately simulate component placement based on available data.

• Environmental Factors: Variations in manufacturing tolerances for both the Jetson module and SODIMM connector could affect alignment if not accounted for.

• User Errors: Misconfigurations or errors in interpreting dimensional data could lead to incorrect placements.

Troubleshooting Steps, Solutions & Fixes

To address alignment issues between the Jetson Orin Nano module and SODIMM connector, users can follow these troubleshooting steps and solutions:

1. Review Available Documentation:

   • Consult the module data sheet for any dimensions that may have been overlooked. Look specifically for section 8, which may contain relevant information.

2. Utilize 3D CAD Models:

   • Access the 3D CAD STEP model for both the Jetson Orin Nano module and SODIMM connector. Ensure you are using compatible software that can accurately interpret these models.

3. Measure Distances:

   • If possible, physically measure existing modules and connectors to gather empirical data on distances that may not be documented.

4. Alignment Strategy:

   • Consider positioning the center of the SODIMM connector at the extreme edge of the Jetson Orin Nano module as a preliminary alignment strategy. This approach has been discussed among users as a potential solution.

5. Community Engagement:

   • Post detailed inquiries on relevant forums or communities dedicated to Jetson products, providing images or diagrams of current designs for feedback.

6. Best Practices for Design:

   • Adopt best practices in PCB design such as using reference points from known dimensions, ensuring proper clearance around components, and considering thermal management aspects that may affect placement.

7. Testing with Prototypes:

   • Create prototype boards based on initial designs and test for functionality. Adjust placements based on testing outcomes.

8. Seek Expert Advice:

   • If challenges persist, consider reaching out directly to NVIDIA support or consulting with professionals who specialize in hardware integration.

9. Documentation Updates:

   • Encourage community members to share any discovered documentation or insights that could benefit others facing similar issues.

By following these steps, users can work towards resolving alignment issues effectively while also contributing to a collective knowledge base for future reference.