Leaf Spring Screw Shoulder Below Keepout Area

Issue Overview

The discussion revolves around a design challenge faced when integrating the Jetson Orin Nano with a leaf spring thermal accessory. The primary issue is that the shoulder of the screws used for mounting is positioned below the top surface of the designated keepout area. This raises concerns regarding the appropriate distance between the System on Chip (SoC) and the cooling surface, which is critical for effective thermal management. Users are experiencing difficulties in ensuring that their custom cooling solutions do not encroach upon this keepout area, which could lead to potential collisions with internal components.

Key points include:

• Symptoms: Difficulty in mounting cooling solutions without intruding into the keepout area.
• Context: The problem arises while developing a custom spacer and cooling solution for the module.
• Hardware/Software Specifications: Involves 3D models of the Jetson Orin Nano and associated thermal accessories.
• Frequency: This issue is consistent during the design phase for multiple users.
• Impact: Potential thermal inefficiency and risk of hardware damage due to improper mounting of cooling solutions.
• Additional Context: Users are exploring how to measure real-life samples to avoid risks associated with ignoring usage guidelines.

Possible Causes

1. Hardware Incompatibilities: The design of the leaf spring may not align with the specifications of the Jetson Orin Nano, leading to mounting issues.

   • Explanation: If components do not fit as intended, it can result in improper thermal contact.

2. Software Bugs or Conflicts: Issues with 3D modeling software or CAD files that do not accurately represent physical dimensions.

   • Explanation: Inaccurate models can mislead users regarding component placement.

3. Configuration Errors: Incorrect configurations during the design phase may lead to conflicts with existing hardware layouts.

   • Explanation: Misconfigurations can cause physical components to overlap with restricted areas.

4. Environmental Factors: Variations in temperature or power supply could affect component behavior during testing.

   • Explanation: Extreme conditions may exacerbate physical alignment issues.

5. User Errors or Misconfigurations: Lack of adherence to guidelines regarding keepout areas could lead to design flaws.

   • Explanation: Ignoring specified limits can introduce risks that compromise system integrity.

Troubleshooting Steps, Solutions & Fixes

1. Diagnosing the Problem:

   • Verify 3D model accuracy by comparing it against actual hardware measurements.
   • Use calipers or a precise measuring tool to check dimensions of both the Jetson Orin Nano and leaf spring.

2. Gathering System Information:

   • Document all dimensions and positions of components using CAD software.
   • Take screenshots of 3D models highlighting areas of concern for further analysis.

3. Isolating the Issue:

   • Test with different configurations by temporarily modifying the leaf spring design to see if it fits without intruding into the keepout area.
   • Experiment with alternative mounting methods that respect the keepout guidelines.

4. Potential Fixes:

   • Redesign the cooling solution to ensure no part extends into the keepout area, possibly using a flat plane as a base for mounting.
   • Consult with NVIDIA or third-party vendors for alternative thermal solutions that comply with specifications.

5. Documentation and Updates:

   • Regularly check NVIDIA’s developer forums for updates on hardware compatibility and recommended practices.
   • Review any new releases or changes in specifications related to Jetson Orin Nano components.

6. Best Practices for Prevention:

   • Always adhere strictly to usage guidelines provided by NVIDIA regarding keepout areas.
   • Engage in thorough prototyping and testing phases before finalizing designs to mitigate risks associated with thermal management.

7. Code Snippets / Terminal Commands:

   # Command example for checking component dimensions in CAD software
   measure --component leaf_spring --dimensions
   

8. Unresolved Aspects:

   • Further investigation may be needed regarding future changes in module designs that could impact existing configurations and designs.

By following these structured troubleshooting steps, users can effectively address issues related to mounting cooling solutions on the Jetson Orin Nano while ensuring compliance with design specifications.